Calendar for EECS 423

Fall 2000

 

Date

Topics

Laboratory

Readings

Report

9/6-8

Introduction

-

Chp. 1

-

9/11-15

Overview/Materials

Lab #1- Orientation/Wafer3

Chp. 2

-

9/18

Safety Seminar4

Must Attend

-

-

9/20-22

Oxidation

Lab #2 - Oxidation

Chp. 4

-

9/25-29

Lithography

Lab #3 - Lith and Etch

Chp. 7, 8

#1

10/2-6

Deposition - CVD

Lab #4 - Gate Oxide/Poly-Si5

Chp. 13

#2

10/9-13

Etching

Lab #5 - Plasma Etch

Chp. 11

#3

10/16-20

Diffusion/Ion Implant

Lab #6 - P-Deposition/Drive in

Chp. 3, 5

#4

10/23-27

Contacts

Lab #7 - Contact Opening

Chp. 15

#5

10/30-11/3

Deposition – Physical

Lab #8- Al Dep6/Etch

Chp. 12

#6

11/6-10

Annealing

Lab #9- Al Backside6

Chp. 6

#7

11/13-17

Device Measurements

10 - Testing

Device

#8

11/20-22

Device Physics

-

Device

-

11/27-12/1

Device Physics

11 - Testing

Device

-

12/4-8

Process Integration

-

Chp. 16

-

12/11-13

NO Class

-

-

-

12/18

Final Lab Report Due

-

-

#9

 

1. Lab Procedures and Lab Report Requirements will be handed out 1 week before each given Lab. You need to review the information prior to each Lab session. We will go over the details of each Lab in class on the Monday of each week.

2. You need to take notes in the Lab and keep any records or data needed for the Lab Report. You are encouraged to ask any questions about the Lab in class and in the Lab.

  1. Lab Orientation (#1) - Everyone has to take a Quiz on Lab safety and common Lab procedures.
  2. A safety seminar will be presented on September 18, 2000 (Monday). You have to attend this safety seminar in order to be allowed to work in the Lab.
  3. Poly-Si Deposition will be carried out by staff in Research Lab.
  4. Al Deposition will be carried out by staff in Research Lab.