Electrical Engineering and Computer Science


MICL Seminar

Leveraging dense package technology in advanced technologies for large SoCs

Bill Isaacson


 
Monday, October 02, 2017
12:00pm - 1:00pm
1012 EECS

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About the Event

Large Networking, Data Center, and Compute ASICs benefit from advanced FinFET technology nodes for improved performance and reduced power. However, the complexity and cost of 16nm and 7nm FinFET technologies creates significant challenges to justifying the ROI for many projects. Dense package technology, such as Silicon Interposer, Fanout packages, and Thin Film build-up enable the possibility for new architectures that can realize the benefit of FinFET technology at much improved ROI. The presentation will discuss real examples of production ASICs leveraging dense package technology.

Biography

Bill Isaacson has more than 20 years of experience in the design and customer support of advanced technology ASICs. At eSilicon he held the position of Sr. Director of Field Applications Engineering, where his team was responsible for working with customers to define the target process technology, IP, contents, and engagement methodology of their ASICs. Previously he held the position of Design Center Manager at LSI Logic where he was responsible for the physical implementation of customer ASICs. Mr. Isaacson holds a BSEE from the University of Illinois at Champaign-Urbana.

Additional Information

Contact: Sarah Benoit

Phone: 734-764-9846

Email: sitowler@umich.edu

Sponsor(s): MICL

Faculty Sponsor: David Blaauw

Open to: Public