3D Lithography & Microstructures for RF MEMS
A new metal surface micromachining technology utilizing 3-D lithography, electroplating, and mechanical polishing has been developed to fabricate various 3-D metal microstructures especially for RF and microwave MEMS applications.
Figure 1. (a) Schematic view of the 3-D photoresist mold for a suspended spiral inductor (b) Final electroplated structure
Figure 2. Fabrication process flow (cross-section in Figure 1a)
Figure 3. SEM pictures of fabricated RF MEMS components: Spiral inductors suspended by (a) 50mm (b) 100mm.
Figure 4. SEM pictures of the fabricated microwave MEMS components (a) transmission lines (b) a coaxial line.
- Jun-Bo Yoon, Byeong-Il Kim, Yun-Seok Choi and Euisik Yoon, "3-D construction of monolithic passive components for RF and microwave ICs using thick-metal surface micromachining technology," IEEE Transactions on Microwave Theory and Techniques, Vol. 51, No. 1, pp. 279-288, Jan., 2003.